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Semiconductor pumped laser marking machine for IC
Semiconductor pumped laser marking machine
speed:7000mm/s
Marking Depth: 0.50mm
Galvo postioning precision: 0.005mm
Semiconductor pumped laser marking machine
Features:
German High-speed marking galvo head,high photoelectric conversion efficiency,high marking speed,fine and permanent marking results
Full optical seal technology,low fault rate,maintence free
It is able to work with diode side pump,diode end pump,fiber and many other types of laser sources
Automatic focus detective and adjustment system can be equipped to meet the drivers needs of marking
Application field:
Suitable for all kinds of ordinary metals and alloys(Iron,copper,aluminium,magnesium,zinc and all metals);rare metals and alloys (gold,silver,titanium);metal oxides,ABS material (electrical appliances case,daily necessities),ink (translucent key-press,printing products),epoxy resin(electronic components packaging,insulation layer)
Technical parameters:
laser beam quality: ≤6
Max.Outout Powe:≤50W
Laser Wavelength:10.64μm/1064nm
Repetition Frequency: ≤50KHZ
Standard Marking Scope: 100mmX100mm(optical)
Marking Depth: ≤0.50mm
Marking speed: ≤7000mm/s
Min.Line Width: 0.015mm
Min.Charactor:0.4mm
Repetition Precision: ±0.01mm
Machine power: 1.5KW
Electric Power Demand: 220V/Single Phase/50Hz/8A
Optical-Path System Size:1220mm*650mm*1200mm
Controlling Size:600mm*600mm*800mm
Cooling System:1.6kw Chiller(Different configuration on different laser sources)
Galvo postioning precision: 0.005mm
